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EPF6016BI256-3

Part No :

EPF6016BI256-3

Manufacturer
Intel
Description
IC FPGA 204 I/O 256BGA
Catalog
Embedded - FPGAs (Field Programmable Gate Array)
DataSheet
EPF6016BI256-3 PDF
Unit Price
詢價(jià)QQ咨詢
Stock Num
0
Min Qty
1
Series
FLEX 6000
Package
Tray

EPF6016BI256-3 Specifications

Type Description
rohs: RoHS
part status: Obsolete
mounting type: Surface Mount
number of i/o: 204
package / case: 256-LBGA
total ram bits: -
number of gates: 16000
voltage - supply: 4.75V ~ 5.25V
number of labs/clbs: 132
operating temperature: -40°C ~ 100°C (TJ)
supplier device package: 256-BGA (27x27)
number of logic elements/cells: 1320